| Manufacturing Technology: | Optoelectronic Semiconductor |
|---|---|
| Material: | Element Semiconductor |
| Type: | Graphite Mold |
| Package: | Wooden Box |
| Signal Processing: | N/a |
| Application: | Semiconductor |
| Samples: |
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| Customization: |
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Audited Supplier Electronic Sintering Graphite Mould With high density
Electronic Sintering
Sintering is a traditional process to transform the powdery material into a compact body. It is very early to use this process to produce ceramics, powder metallurgy, refractory materials, super high temperature materials and so on. Generally, after the powder is formed, the compact body obtained by sintering is a kind of polycrystalline material, and its microstructure is composed of crystal, vitreous body and stomata. The sintering process directly affects the size of grain, the size of the pores and the shape and distribution of grain boundary in the microstructure. The properties of inorganic materials are not only related to the composition of the materials (chemical composition and mineral composition), but also closely related to the microstructure of the materials.
Electronic Sintering Detail Picture
Graphite Technical Characteristic
| Grade | MSL80 | MSS80 | MSL85 | MSS85 |
| Grain Size (μm) |
25 | 25 | 25 | 25 |
| Bulk Density (≥g/cm3) |
1.8 | 1.8 | 1.85 | 1.85 |
| Compressive Strength (≥MPa) |
60 | 60 | 70 | 70 |
| Flexural Strength (≥MPa) |
30 | 30 | 35 | 35 |
| Porosity (≤%) |
21 | 21 | 18 | 18 |
| Specific Resistance (≤μΩm) |
12 | 12 | 12 | 12 |
| Ash Content (≤%) |
0.08 | 0.08 | 0.08 | 0.08 |
| Shore Hardness | 48 | 48 | 50 | 50 |
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Audited Supplier 
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